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    Product Information

    Place of Origin China
    Brand Name PCBWell
    Model Number PW-24-09-A0
    Targrt products PBGA, FBGA, FMC, SIP, MCP, FCCSP, POP, FCBGA, LGA, etc
    Core material MGC, Doosan, LG, Hitachi, Sumitomo, AMC
    SR material Taiyo, Hitachi, Sumitomo, SanEl
    Pattern Tenting, MSAP, PSAP, ETS, SAP
    Soldermask PSR series
    Surface Finish E’tro-Ni/Au ENIG, ENEPIG OSP(AFOP) Hard Au
    Warranty 1 year
    Size Customized
    MOQ 1 strip
    Application Smart phones, Networks, Customer electronics, Personal computers, etc

    MCL-E-795G

    Halogen Free, High Tg, High Elastic Modulus and Low CTE material

    About the material

    Product form
    CCL MCL-E-795G
    Prepreg GEA-795G
    Applications
    • Semiconductor packages. (FC-BGA)
    • Center core for Buildup construction.
    Features
    • MCL-E-795G has low CTE value in X, Y directions and can reduce warpage of package significantly.
    • MCL-E-795G type LH has low CTE value.
    • Well-suited for Center Core of Buildup construction.
    Characteristics
    • Semiconductor packages. (FC-BGA)
    • Center core for Buildup construction.
    Characteristics
    TEG Chip Image
    TEG Chip
    • Die size: 20mm×20mm
    • Die height: 775 μm
    TEG Substrate
    • Package size: 40mm×40mm
    • Core thickness: 0.4mm / 0.8mm
    • BU thickness: 20 μm
    • SR thickness: 19 μm

    ItemCondition ※4UnitActual ValueReference
    (IPC-TM-650)
    MCL-E-
    795G    		MCL-E-
    795G
    (Type X)    		MCL-E-
    795G
    (Type L)    		MCL-E-
    795G
    (Type LH)
    TgTMA methodA℃260–2902.4.24
    DMA methodA315–345–
    CTE ※1X (30–120℃)Appm/℃3.0–5.02.0–4.01.0–3.50.5–3.0–
    Y (30–120℃)A3.0–5.02.0–4.01.0–3.50.5–3.0
    Z ※2(＜Tg)A10–152.4.24
    (＞Tg)A70–100
    Solder Heat Resistance (260℃)Asec.＞300–
    T-260 (Without Copper)Amin.＞602.4.24.1
    T-288 (Without Copper)A＞60
    Decomposition Temperature (TGA, 5% weight loss)A℃470–4902.3.40
    Heat Resistance for HDI Process (Semi-Additive)260℃ Reflowcycles＞20–
    Copper Peel Strength12 µmAkN/m0.7–0.92.4.8
    18 µmA0.8–1.0
    Flexural Modulus (X) ※2AGPa35–3737–3939–4140–42–
    Dielectric Constant1GHz ※3A–4.3–4.54.2–4.44.1–4.34.1–4.3–
    Dissipation Factor1GHz ※3A–0.005–0.0070.005–0.0070.005–0.0070.005–0.007–
    Volume ResistivityC-96/40/90Ω･cm1×1014–1×10162.5.17
    Surface ResistanceC-96/40/90Ω1×1013–1×1015
    Insulation ResistanceAΩ1×1014–1×1016–
    D-2/1001×1012–1×1015–

    ※1  Heating Rate: 10℃/min.
    ※2  For 800um thickness.
    ※3  Measured by SPDR.
    ※4  Refer to “Condition Note”
    ※  Above data are experimental results and not guaranteed.

    Standard Specifications
     



    Copper Clad Laminate
     
    Part NumberTypeCopper Foil ThicknessThickness CodeActual thickness and Tolerance
    MCL-E-
    795G    		–12 µm
    18 µm
    (STD)
    2 µm
    3 µm
    12 µm
    (LP)    		M0.060.06mm
    0.10.11mm
    0.20.21mm
    0.410.41mm
    0.610.61mm
    0.810.82mm
    1.011.02mm
    1.211.23mm
    1.411.43mm
    (X)12 µm
    18 µm
    (STD)
    2 µm
    3 µm
    12 µm
    (LP)    		0.410.41mm
    0.610.62mm
    0.810.82mm
    1.011.02mm
    1.211.23mm
    1.411.43mm
    (L)12 µm
    18 µm
    (STD)
    2 µm
    3 µm
    12 µm
    (LP)    		0.10.11mm
    0.20.21mm
    0.410.41mm
    0.610.62mm
    0.810.82mm
    1.011.03mm
    1.211.24mm
    1.411.44mm
    (LH)12 µm
    18 µm
    (STD)
    2 µm
    3 µm
    12 µm
    (LP)    		D0.150.16mm
    0.20.21mm
    0.410.43mm
    0.610.64mm
    0.810.85mm
    1.011.07mm
    1.211.28mm
    1.411.49mm

    ※1  STD: Standard copper foil, LP: Low Profile copper foil.
    ※2  The thickness means that of dielectric layer.

    Prepreg
    Part Number Type Glass Cloth Properties
    Style Resin Content (%) Dielectric Thickness after Lamination ※1 (mm)
    GEA-795G – 0.03 (1027N76) 1027 76±2 0.044
    0.04 (1037N76) 1037 76±2 0.053
    0.06 (1078N66) 1078 66±2 0.072
    (L) 0.03 (1027N76) 1027 76±2 0.044
    0.04 (1037N76) 1037 76±2 0.053
    0.06 (1280N63) 1280 63±2 0.072

     

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